Silex Microsystems has signed a definitive asset purchase agreement to acquire ON Semiconductor’s 200mm wafer fab in Pennsylvania for $40 million, converting it into a dedicated MEMS foundry. This marks Silex’s first U.S. manufacturing foothold.

Total CAPEX for the project is estimated at SEK 1.6 billion, covering acquisition and conversion costs – with SEK 1 billion allocated across 2026–2027 and ~SEK 200 million annually from 2028–2030, funded via existing cash and credit lines. The facility targets EBIT break-even by 2029–2030, with revenue and profitability matching Silex’s Swedish 200mm line 2025 performance by 2034. The deal is expected to close by end-2027, subject to CFIUS review and standard conditions.

CEO Edvard Kälvesten noted that U.S.-based MEMS capacity shortens delivery lead times, strengthens collaboration with North American clients, and hedges geopolitical supply risks. Acquiring an existing fab offers better capital efficiency than greenfield construction, leveraging existing infrastructure and a ~130-person workforce.

The site has 3,000 sqm of cleanroom with 12,000 sqm of expansion space – roughly double Sweden’s footprint post-conversion. The transaction covers only real estate, facilities, and equipment – no equity transfer, and Silex will not take over ON Semi’s IC production orders. A $10 million deposit** was paid at signing, with the remaining **$30 million due at closing.

Through 2026–2027, Silex will conduct product qualification, process transfer, and team training, aiming to retain the existing ~130 employees and expand as operations grow.

From ICgoodFind: MEMS is a geography game – and Silex just planted a flag in the U.S. Converting an existing 200mm line for sensors is faster and cheaper than building new. The message: localized MEMS capacity is now a competitive weapon.